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STEP 3. Soldering BGA systems and diagnostics using an oscilloscope.



Cena: 4 300.00zł netto

STEP 3. Soldering BGA systems and diagnostics using an oscilloscope.

Electronics Repair

Replace BGA, THT, SMT systems.

Learn to use an oscilloscope to streamline the diagnostic process.

Locate faults using a thermal imaging camera.

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Koszyk

 

4300zł

+23% VAT

Data

Start 03.03.2025

Miejsca

Zostało 1 miejsce

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Formy płatności

Przelewy24 mBank raty

Kurs prowadzi:Maciej Piela

Maciej Piela

Najbliższy termin szkolenia

Start 03.03.2025Koniec 07.03.2025

Data
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Forma

Szkolenie hybrydowe40 teaching hours (5 days)

Forma
Dowiedz się o stanowisku

Poziom

Intermediate level 

Forma
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Co zyskasz dzięki szkoleniu?

  • You will replace systems assembled using BGA, THT, SMT technology.Due to the possibility of obtaining an unrivaled large number of connections in a small area, manufacturers of portable computers, but also cars, household appliances and industrial devices prefer systems assembled using this technology.
  • You will use a BGA machine to replace sockets or connectors.During the course, you will have the opportunity to use them for less standard solutions, convincing yourself that replacing a typical EDP connector or keyboard can be even simpler and faster.
  • You will perform a thorough visual inspection of the condition of the motherboard. During the training, we will show you how important a thorough inspection can be, performed using supporting tools such as microscopes.
  • You will appreciate the usefulness of an oscilloscope.The oscilloscope is commonly used in design and laboratory technology. As part of the course, you will have the opportunity to use it yourself to improve the diagnostic process. You will learn, among other things, how to confirm the efficiency of the RTC or what the SMBus bus measurement can be useful for.
  • Compare thermal imaging cameras.Sometimes the best way to locate a fault is to use a thermal imaging camera. With us, you will have the opportunity to compare these devices from different price groups.

Dla kogo jest szkolenie?

  • People who want to learn how to solder according to IPC standards. Quality matters. In addition to the correct assembly of components on the board, we place great emphasis on the quality of workmanship. We want the repair to be done with an emphasis on quality and aesthetics.
  • People who want to learn how to replace BGA systems.Regardless of the sector of electronics you work in, BGA is an important part of it. Modern and future assembly technologies require the technician to be able to replace Ball Grid Array systems.
  • Technicians who want to develop their skills.BGA machine, inspection devices, oscilloscope, thermal imaging cameras - using these devices in workshop technology significantly increases your value on the job market.
  • People repairing electronics.If you are a person who repairs electronics as a hobby or would like to expand the range of your services to include the topics discussed, this training is for you.
  • Service technicians with intermediate knowledge.After completing the training, you will be able to expand the portfolio of services performed with additional important items. You will no longer refer a customer to the competition to replace a BGA system correctly diagnosed by you.

STEP 3. Soldering BGA systems and diagnostics using an oscilloscope.

Dołącz do szkolenia   4300zł +23% VAT

Dlaczego warto?

Upon completion of the training, the participant will be able to solder BGA systems, which is a key skill in the world of modern electronics, where this type of integrated circuits are used in advanced devices such as computers, smartphones and game consoles.Mastering this technique allows for effective repair and maintenance of devices that are characterized by high component density and small size.

STEP 3. Soldering BGA systems and diagnostics using an oscilloscope.
  • Nauczysz się postępować z układami scalonymi.
  • Wymienisz każdy układ BGA.
  • Zwiększysz portfolio swoich usług.
  • Sprawnie oszacujesz koszty konkretnych napraw.
  • Mając wiedzę ze szkolenia przyspieszysz swój rozwój zawodowy.

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Agenda

Zawartość szkolenia

Termin Najbliższy termin
03.03.2025
Czas trwania 40 teaching
hours
Forma Forma
hybrydowa
Czas trwania Intermediate
level

Rozwiń wszystko Rozwiń

01Construction and storage principles of high-performance integrated circuits assembled using BGA technology.
02Discussion of issues related to the replacement of binder in some factory new systems.
03Preparing BGA systems for the assembly process.
04Recommendations for creating profiles and practical configuration of BGA machines.
05Putting the system replacement process into practice. Rozwińszczegóły

  • Preparing the motherboard for system disassembly.
  • BGA system disassembly.
  • Inspecting the board and preparing it for installation of a new component.
  • Assembly of the prepared integrated circuit.
  • Preparing the board for mounting in the target device.
06Ways to use the machine for replacing components other than BGA systems.
07Oscilloscope - device operation. Rozwińszczegóły

  • Types of devices.
  • Construction of a typical digital oscilloscope.
  • Preparing the device for work.
  • Analysis of equipment capabilities using a reference signal as an example.
08Use of the oscilloscope in workshop technique. Rozwińszczegóły

  • Measurements are typically performed with a multimeter.
  • Measurements that are within the exclusive competence of the oscilloscope.
09Stereoscopic microscope - practical differences between devices from different price ranges (due to logistical issues, this part of the training is carried out only on-site).
10Thermal imaging cameras - capabilities of devices with various parameters (due to logistical issues, this part of the training is conducted only on-site).
11Programmers dedicated to the laptop industry - differences and similarities between the two most popular projects.
12Workshops using equipment available at the service center (serviced computers can be provided by the course participant).

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Informacje o szkoleniu

Online training form
Online training form

online via the ZOOM platform from 08:45 to 16:00. Thanks to the large infrastructure connected to the logistics department, you will receive all the service equipment needed to complete the course by courier for the duration of the training. After completing the training, the equipment is also collected by courier. The cost of transport/shipping both ways is already included in the training price.

On-site training format
On-site training format

Classes are conducted in specially prepared and adapted rooms.

Room No. 1 consists of 6 workstations where training participants gain theoretical and practical knowledge.

Room No. 2 consists of 6 workstations where training participants gain theoretical and practical knowledge.

Room no. 3 consists of 8 workstations where training participants gain theoretical and practical knowledge.

Online training equipment
Online training equipment

What we send during the training:

tip soldering iron, hot air soldering iron, laboratory power supply with cables, smoke vapor absorber, EPZ programmer, silicone soldering mat, measurement probe, multimeter, ESD brush, pendrive, box with small service tools: (set of necessary screwdrivers, opener , spatula, tweezers, knife, soldering binder, absorbent tape, flux, binder extractor, pliers, isopropanol, prepared laptops/motherboards with ready-made faults, visualizer, antistatic apron.

Day schedule
Day schedule

8:45 - Start of training.

10:15-10:30 - Break 15 min.

12:00-12:45 - Lunch break 45 min.

14:15-14:30 - 15 min break

16:00 - End of training.

Each student completing the training on site has coffee from an espresso machine, biscuits, tea and water at their disposal. Lunch is included in the price of the training.

Deadlines, information, questions:
Deadlines, information, questions:

Jeśli masz pytania, skontaktuj się z nami, chętnie Ci pomożemy. Jesteśmy dostępni od 8:00-16:00.

Aleksandra Dziadowiec

tel: +48 572-995-842

E-mail: adziadowiec@notemaster.pl

Technical assistance
Technical assistance

If you need help with equipment for a training station, our team is available 24 hours a day.

Maciej Piela

tel: +48 518-115-526

E-mail: mpiela@notemaster.pl

Dołączam do szkolenia

Co dostaniesz po szkoleniu?

Certificate

After completing the training, each participant receives a Notebook Master certificate and an electronic certificate.

The certificate contains: the name and surname of the participant, the name of the training, the number of hours of training, the name and address of the organizer, the deadline for completing the training, the certificate number and the date of issue, the MSUES quality mark and the mark of entry into the Register of Training Institutions (RIS). Moreover, after completing each stage of training, the participant receives a certificate confirming its completion. The document contains the above information and the name of the stage.

Teaching materials

After the course, you will receive training materials that will help you improve your knowledge when working independently as a service technician repairing electronic equipment.

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Notebook Master sp.z o.o centrumszkolen@notemaster.pl
Anna Godzik-Stawiarz Anna Godzik-Stawiarz +48 790 347 302 astawiarz@notemaster.pl
Stanisław Piela Stanisław Piela +48 796 146 189 spiela@notemaster.pl
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