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STAGE 3. Replacing BGA microcontrollers



Cena: 2 580.00zł netto

STAGE 3. Replacing BGA microcontrollers

Electronics in the automotive

Learn to prepare BGA chips for the assembly process.

Replace systems assembled using BGA technology.

Learn to create profiles and configure the BGA machine for a given system.

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Koszyk

 

2580zł

+23% VAT

Data

Start 03.03.2025

Miejsca

Zostało 1 miejsce

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Formy płatności

Przelewy24 mBank raty
STAGE 3. Replacing BGA microcontrollers

Kurs prowadzi:Michał Brach

Michał Brach

Najbliższy termin szkolenia

Start 03.03.2025Koniec 05.03.2025

Data
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Forma

Szkolenie hybrydowe 40 teaching hours (5 days)

Forma
Dowiedz się o stanowisku

Poziom

Intermediate level 

Forma
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Dołącz do ponad 3606 kursantów

Co zyskasz dzięki szkoleniu?

  • Practical knowledge of how to replace systems mounted in BGA technology.Due to the possibility of obtaining an unrivaled number of connections in a small space, car controller manufacturers prefer systems mounted in this technology.
  • Skills on how to use time profiles for BGA disassembly.During the course you will have the opportunity to calibrate the BGA machine for a given system. You will be able to save the profile and use it when disassembling the next system.
  • Specific information on how to prepare the system for assembly. New systems have a solder binder and are ready for installation. The binder applied to them has hydroscopic properties, i.e. it absorbs water. If we are not sure in what conditions the system was stored, it is recommended to replace the solder with a new one.
  • I know how to assemble the system using time profiles.When assembling a BGA system, you will use a time profile previously prepared for a given system, which makes the system assembly procedure virtually maintenance-free.

Dla kogo jest szkolenie?

  • Car mechanics. The automotive world is evolving with the development of car technologies. Modern cars are controlled by complex electronic systems, which creates new opportunities for automotive enthusiasts. The course will be appreciated by people who want to go beyond traditional mechanical repairs and discover the potential of control electronics.
  • Electromechanics.The training is addressed to electromechanics who want to expand their skills and gain new qualifications in the area of ​​diagnostics, repair and optimization of modern electronic systems in vehicles.

STAGE 3. Replacing BGA microcontrollers

Dołącz do szkolenia   2580zł +23% VAT

Dlaczego warto?

After completing the training, the participant is able to solder BGA systems, which is a key skill in the automotive world, where this type of systems are used in all kinds of controllers responsible for engine operation, operation of comfort zones, radios, etc.Mastering this technique allows for effective repair of the above-mentioned controllers.

STAGE 3. Replacing BGA microcontrollers
  • Practical knowledge of how to replace systems mounted in BGA technology.Due to the possibility of obtaining an unrivaled number of connections in a small space, car controller manufacturers prefer systems mounted in this technology.
  • Skills on how to use time profiles for BGA disassembly.During the course you will have the opportunity to calibrate the BGA machine for a given system. You will be able to save the profile and use it when disassembling the next system.
  • Specific information on how to prepare the system for assembly. New systems have a solder binder and are ready for installation. The binder applied to them has hydroscopic properties, i.e. it absorbs water. If we are not sure in what conditions the system was stored, it is recommended to replace the solder with a new one.
  • I know how to assemble the system using time profiles.When assembling a BGA system, you will use a time profile previously prepared for a given system, which makes the system assembly procedure virtually maintenance-free .

Potrzebujesz pomocy?

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Agenda

Zawartość szkolenia

Termin Najbliższy termin
03.03.2025
Czas trwania 40 teaching
hours
Forma Forma
hybrydowa
Czas trwania Intermediate
level

Rozwiń wszystko Rozwiń

01Construction and principles of storage of high-performance integrated circuits assembled using BGA technology.
02Discussion of issues related to the replacement of binder in some factory-new systems.
03Preparing BGA systems for the assembly process.
04Recommendations for creating profiles and practical configuration of BGA machines.
05Conducting the system replacement process in practice. Rozwińszczegóły

  • Preparing the motherboard for disassembly of the system.
  • Disassembly of the BGA chip.
  • Inspection of the board and its preparation for installation of a new component.
  • Assembly of the prepared integrated circuit.
  • Preparing the board for installation in the target device.
06Ways to use the machine to replace components other than BGA systems.

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Informacje o szkoleniu

Form of stationary training
Form of stationary training

Classes are conducted in specially prepared and adapted rooms.

Room No. 1 consists of 6 workstations where training participants gain theoretical and practical knowledge.

Room No. 2 consists of 6 workstations where training participants gain theoretical and practical knowledge.

Room no. 3 consists of 8 workstations where training participants gain theoretical and practical knowledge.

Daily schedule
Daily schedule

8:45 - Start of training.

10:15-10:30 - Break 15 min.

12:00-12:45 - Lunch break 45 min.

14:15-14:30- Break 15 min.

16:00 - End of training.

Each student completing the training on site has coffee from an espresso machine, biscuits, tea and water at their disposal. Lunch is included in the price of the training.

Deadlines, information, questions:
Deadlines, information, questions:

Jeśli masz pytania, skontaktuj się z nami, chętnie Ci pomożemy. Jesteśmy dostępni od 8:00-16:00.

Aleksandra Dziadowiec

+48 572 995 842

E-mail: adziadowiec@notemaster.pl

If you have any questions, please contact us, we will be happy to help you. We are available from 8:00 a.m. to 4:00 p.m.

Aleksandra Dziadowiec

+48 572 995 842

E-mail: adziadowiec@notemaster.pl

Technical support
Technical support

If you need help equipping your training station, our team is available 24 hours a day.

Maciej Piela

tel: +48 518-115-526

E-mail: mpiela@notemaster.pl

Dołączam do szkolenia

Co dostaniesz po szkoleniu?

Certyfikat

After completing the training, each participant receives a Notebook Master certificate and an electronic certificate.

The certificate contains: the name and surname of the participant, the name of the training, the number of hours of training, the name and address of the organizer, the deadline for completing the training, the certificate number and the date of issue, the MSUES quality mark and the mark of entry into the Register of Training Institutions (RIS). Moreover, after completing each stage of training, the participant receives a certificate confirming its completion. The document contains the above information and the name of the stage.

Training materials

After completing the course, you will receive training materials that will help you consolidate your knowledge of diagnostics and repair of car electronics.

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Dołączam do szkolenia

contact

Notebook Master sp.z o.o centrumszkolen@notemaster.pl
Anna Godzik-Stawiarz Anna Godzik-Stawiarz +48 790 347 302 astawiarz@notemaster.pl
Stanisław Piela Stanisław Piela +48 796 146 189 spiela@notemaster.pl
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